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Position:Home  >  Product Center  >  Power Semiconductor Test System  >  Reliability Test System  >  MX300-C Power Device Thermal Characteristics Test System
MX300-C Power Device Thermal Characteristics Test System
The MX300C Series Power Device Thermal Characteristics Test System is an automated thermal characteristics test bench mainly consisting of data acquisition unit, temperature control unit, and power supply. It is primarily used for power cycling and thermal characteristic testing of power devices such as IGBT and SiC MOSFET modules, with the ability to simulate and measure device performance throughout their operational lifespan.

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Communication protocol


    • High testing accuracy and rapid heating current removal.
    • Real-time diagnosis of structure and function: Rapidly identify failure progression, cycle count, and fault causes and automatically stop the test.
    • Compatible with testing of power devices including IGBT, MOSFET, and diode fabricated from Si/SiC/GaN materials. The equipment also features testing capability for TO-packaged devices.
    • Support minute- and second-level power cycling, min. TON at 0.5s.
    • Three test channels supporting up to 18 stations, with individually controlled gate voltage (-30V ~ +30V) at each station.
    • Three test channels with independent flow control, featuring reserved coolant ports for experiments with external cooling plate.