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Position:Home  >  Product Center  >  Power Semiconductor Test System  >  Reliability Test System  >  MX300-R High Temperature Reverse Bias/Gate Bias Test System
MX300-R High Temperature Reverse Bias/Gate Bias Test System
The MX300-R Series High Temperature Reverse Bias/Gate Bias Test System is a high-temperature voltage stress life test equipment. It primarily consists of heating and temperature control units, high/low voltage sources, as well as relevant control and acquisition units. This system is mainly used for voltage stress life tests on power devices such as IGBT, SiC MOSFET and diode to evaluate their reliability.

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    • It features high testing accuracy. The current range is automatically adapted based on the measured leakage current, ensuring high measurement accuracy.
    • It monitors test temperatures and other data in real time, detects voltage per channel, leakage current at test stations and test chamber temperature, and thereby plots the corresponding curves.
    • Independent high-voltage breakdown protection, with protective devices connected in series at each test station to prevent damage to the test board by device failure.
    • The system supports testing of power devices – including IGBTs, MOSFETs, and diodes – compatible with SI, SiC and GaN materials, and accommodates various packaging forms such as discrete devices and modules.