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Position:Home  >  Product Center  >  Power Semiconductor Test System  >  Reliability Test System  >  MX300C Thermal Characteristics Test System
MX300C Thermal Characteristics Test System
MX300C series is an automated thermal characteristics test system for power semiconductor. It consists of sampling unit,temperature control unit, power supply unit and system control unit. It is mainly suitable for power cycling test and thermal resistance test of power semiconductor such as IGBT(Si/SiC/GaN materials), MOSFET, DIODE, and etc., to evaluate the performance of power semiconductor during service life.

Catalog

Datasheet

User manual

Communication protocol
    • High accuracy for constant temperature plate.
    • Real-time fault diagnosis function.
    • Remote monitoring function.
    • Multiply protection: over-temperature, smoke alarm, coolant leakage detection, and etc.
    • Compatibility: IGBT/DIODE/MOSFET/BJT/SCR test.
    • UPS power supply system: ensure system and data security under power off condition.